ALPHA® ■
Solder Paste
(See Soldering Lead-Free Alloys) (See Soldering Paste Selector Guide)

NO-CLEAN SOLDERING PASTE PRODUCTS
ALPHA OM-5100 Solder Paste
- Broad latitude, no-clean solder paste; appropriate for most tin-lead SMT applications
- Soldering with Higher reflow yields with excellent print deposit consistency
- Reduced random and mid-chip solder balls and other soldering problems
ALPHA OM-338 T (ZHP) Solder Paste
- Broad latitude, no-clean solder paste; appropriate for most lead-free soldering SMT applications
- Wide reflow process window and outstanding voiding resistance
- Ultra-fine pitch printing capability at up to 200mm/sec. (8 in./sec) print speed
ALPHA OM-338 PT (ZHP) Solder Paste
- Excellent in-curcuit pin testability
- Superior soldering performance in closed-head printers
- Wide print process window up to 150mm/sec. (6 in./sec.)
ALPHA OM-338 CSP (ZHP) Solder Paste
- Broad latitude lead-free, no-clean solder paste
- 0.4mm pitch BGA enabling soldering technology
- Excellent print capability across various board designs
ALPHA OM-340 (ZHP) Solder Paste
- Broad latitude lead-free, no-clean solder paste
- Excellent in-circuit pin testability
- Better soldering spread and wetting
ALPHA OM-350 (Halogen-Free) Solder Paste
- Reduced defects soldering (voiding, mid-chip solder balls, BGA pillows)
- Excellent pin-in-through-hole performance
- Best-in-class electrical reliability
- Excellent print volume repeatability up to100mm/sec.print speed
ZHP: ZERO Halogen Product
ALPHA ZERO Halogen products have no intentionally added halogens in their formulations.
OM-338PT No-Clean Soldering Paste

OM-338PT 16 mil (0.40mm) pitch
OM-338 T No-Clean Soldering Paste

Soldering Photomicrograph of fine-feature solder paste deposits produced at 200mm/sec print speed.
WS-809 Water-Soluble Soldering Paste

WS-809 Water-Soluble 16 mil (0.40mm), 75% RH 36+ hours soldering

ALPHA® ■
Soldering Paste
Choose a soldering product by clicking on the solder product name below.
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Performance Indicators |
Product Name |
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Pb Free Alloys |
Sn/Pb Alloys |
Powder Size |
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Universal, Highest
Print Speed |
ALPHAŽ
OM-338 T |
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88.5% |
M13 |
ROL0 |
83.3%
M04 |
ND |
| Universal, Pin Testable, Enclosed Print Heads |
ALPHAŽ
OM-338 PT |
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88.5% |
M15 |
ROL0 |
NA |
ND |
| High Soak Profile, Paste in Through Hole |
ALPHAŽ
OM-350 |
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• |
• |
• |
• |
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89.0% |
M16 |
ROL0 |
TBD |
<500 ppm |
| Increased Spread Wetting |
ALPHAŽ
OM-340 |
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• |
• |
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89.0% |
M18 |
ROL0 |
NA |
ND |
| Ultra Fine Feature, High Soak Profile |
ALPHAŽ
OM-325 |
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• |
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89.0% |
M19 |
ROL0 |
NA |
<500
ppm |
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88.8% |
M19 |
ROL0 |
84%
M05 |
<500 ppm |
| Universal Water Soluble |
ALPHAŽ
WS-819 |
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89.4% |
M17 |
ORH0 |
85% M9 |
<500
ppm |
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Universal, Wide Process Window |
ALPHAŽ
OM-5100 |
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• |
• |
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90.0% |
M13 |
ROL0 |
85%
M04 |
ND |
| Universal Dispense Paste |
ALPHAŽ
CL-78 |
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• |
• |
• |
• |
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85.0% |
M04 |
ROL1 |
85%
M04 |
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| Universal, Best Joint Cosmetics |
ALPHAŽ
WS-609 |
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• |
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90.0% |
M13 |
ORH0 |
85%
M07 |
ND |
| Stencil Life, Joint Cosmetics, Cleanability |
ALPHAŽ
WS-809 |
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90.0% |
M18 |
ORH0 |
NA |
<500
ppm |
* ND = Non-Detectable
WATER-SOLUBLE SOLDERING Paste PRODUCTS
ALPHA WS-809 Solder
- Broad-latitude, water-soluble tin-lead solder paste; appropriate for most SMT soldering applications
- Excellent balance of stencil life and cleanability
- Provides excellent voiding resistance
- Delivers excellent throughput and high first pass yield
ALPHA WS-819
Solder
- Long stencil life under varying ambient conditions
- Excellent resistance to BGA voids
- Ease of cleaning with aqueous wash systems
To fully support SMT solder printing requirements, Cookson Electronics also offers a complete line of ALPHAŽ Soldering Paste Stencils and Solder Cleaners.

Other solder and soldering products:
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